Global Semiconductors (Equipment Makers): Backend to Shine
Positive backdrop for equipment makers driven by reshoring efforts and global capacity expansion
Chief Investment Office13 Aug 2025
  • The global semiconductor equipment maker market is projected to experience growth of 4.7% in 2025
  • Easing US-China tensions buoyed market sentiment, especially for companies with exposure to China
  • US policy tailwinds support growth in US and benefit globally diversified equipment makers
  • Frontend equipment makers remain key for growth amid sustained demand for advanced nodes
  • Advanced packaging is viewed as essential, boosting the strategic importance of backend processes
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WFE growth momentum set to continue. The wafer fab equipment (WFE) market recorded strong growth of 8.6% y/y, reaching USD111.6bn in 2024. This positive momentum is expected to persist into 2025 and 2026, driven primarily by continued investment in Artificial Intelligence (AI) infrastructure. While AI remains the core driver of industry growth, the broader semiconductor recovery, particularly among previously lagging segments such as backend equipment and outsourced semiconductor assembly and test (OSAT) providers, should support a more balanced and resilient industry expansion. The global semiconductor equipment maker market is hence projected to grow 4.7% in 2025 and another 8.1% in 2026.

Favourable outlook for equipment makers. The landscape for semiconductor equipment makers remains constructive, underpinned by reshoring efforts and global capacity expansion plans. Recent signs of easing US-China tensions, notably the reversal of the export ban on Nvidia’s H20 chip, have further buoyed market sentiment, especially for companies with significant exposure to China. Additionally, the newly announced 100% semiconductor tariff for exports to the US, while having 0% tariffs for those with investments in the US, is positive for equipment makers in the US as more fabs are built there. Adding to this positive momentum, the US lifted export restrictions on Electronic Design Automation (EDA) tools to Chinese customers in early July, effectively rescinding licensing requirements introduced in May. These regulatory rollbacks enhance the operating environment for globally diversified equipment players.

Frontend leads, but backend is catching up as advanced packaging becomes critical. While frontend equipment makers, which focus on early fabrication processes like lithography, deposition, and etching, remain a key growth driver amid sustained demand for advanced nodes, backend players are beginning to catch up as the market recovers. Teradyne’s 2Q25 earnings exceeded consensus expectations and its forward guidance points to a robust second half, supported by AI-driven demand for semiconductor testing. Kulicke & Soffa, another backend semiconductor company, also reported results above expectations and is anticipating a better quarter ahead. Advanced packaging is increasingly viewed as a strategic necessity, and no longer optional, with technologies like chiplets and 3D ICs becoming key enablers for AI, HPC, 5G, and edge computing. This shift has increased the importance of backend processes and positioning these companies for renewed growth.


Figure 1: Semiconductor wafer fab equipment sales forecasts (USDbn)

Source: Gartner, DBS


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